Τα καλάθι αγορών σας είναι άδειο!
Product Specifications
Basic Parameters |
|
Heating |
IR |
Dimension |
L475mmx W480mmx H420mm |
Weight |
15kg |
Total weight |
About 17 kg, vary with the differen need of the users |
Electrical Parameters |
|
Power |
110V or 220V AC |
Upper Heating |
IR |
Size of Upper heating |
80mm x 80mm |
Consumption of upper heating |
400W |
Bottom Heating |
IR |
Size of Bottom heating |
170mm*170mm |
Consumption of Bottom heating |
800W |
General power |
1250W |
Temperature Control
|
|
Control mode of Upper | Independent temperature control, high-precision closed-loop control, precision ± 0.5% |
Control mode of Bottom | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm |
Rework Function | |
SMD | Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Reworkwelding |
Size of applicable chips | ≤70mm x70 mm |
Size of applicable PCB | ≤400mm x305mm |
|
|
|